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injection grade anti-static PEEK granules

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Anti-static PEEK Granules|Injection Grade

ESD PEEK granules (also known as anti-static PEEK pellets) are carbon-fiber modified compounds engineered for injection molding of semiconductor components. They deliver stable surface resistivity of 10⁶–10⁹ Ω/sq, protecting sensitive circuits from static damage while retaining PEEK's high-temperature strength.
Designed for cleanroom environments, these electrostatic dissipative granules offer continuous service at 260°C and excellent chemical resistance. ESD PEEK is the preferred material for test sockets, wafer carriers, and precision gear systems requiring both EMI protection and structural reliability

Material:	carbon fiber reinforced PEEK
Electrostatic protection value:	ESD E4-E9 ESD E5-E8 ESD E6-E9 E9-E11
MOQ:	5kg
Packing:	25kg/bag in box
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Model:
PEEK-880ESD
Brand:
PRES

Product Description

| Injection Grade Antistatic PEEK Pellets | ESD-Safe & High Performance

PRES ESD PEEK pellets achieve electrostatic dissipative properties through a conductive network formed by interconnected conductive fillers within the PEEK matrix. Carbon fiber is used as the conductive filler in the PRES ESD PEEK grade.

This carbon-fiber reinforcement provides a combination of controlled electrical resistance and high mechanical performance. For the specified PRES grade, representative properties include a surface resistivity of 10⁶–10⁹ Ω/sq, tensile strength of approximately 210 MPa, flexural modulus of approximately 16 GPa, and HDT up to 325°C (617°F). The material also exhibits a low coefficient of linear thermal expansion, approximately 8 ppm/K above Tg under the specified test conditions.

ESD PEEK Surface resistance test

After compounding and pelletizing, the PRES ESD PEEK pellets are tested for surface resistance. In the representative test shown below, the pellets show a surface resistance of approximately 10⁸Ω/sq.

10^8 Ω resistance ESD PEEK pellets

How to Achieve the Target Resistance After Injection Molding?

A pellet-level resistance of approximately 10⁸ Ω/sq does not mean that every molded part will automatically have the same resistance. The final surface resistance is affected by the part geometry, gate design, carbon-fiber distribution, and injection-molding parameters.

For the carbon-fiber ESD PEEK formulation evaluated by PRES, injection speed and melt temperature are two important process variables for adjusting the final surface resistance. Gate design is also critical because excessive shear at a small gate can shorten carbon fibers and change the conductive network.

In our tested molding conditions, a relatively large gate, approximately 3.5 mm or larger, was used to reduce excessive fiber breakage. The appropriate gate size should be determined according to the part geometry, fiber loading, flow length, and mold design.

The optimal melt temperature and mold temperature should be established through controlled molding trials for each part.

For detailed processing and resistance-adjustment guidance, see:how to injection ESD PEEK pellets?

⚙️ Precision Moldable

Low shrinkage(0.2% along flow,0.7% across flow test unber ISO 294-4) and high flow enable tight-tolerance ESD-safe components without post-molding coatings.

✔️ ESD-Safe by Nature: No carbon sloughing or coating degradation.
✔️ Metal-Replacement Capable: Lightweight alternative to aluminum in static-sensitive assemblies.
✔️ Cleanroom Compatible: Low outgassing, chemically inert, and dimensionally stable.

Unique ESD PEEK Formula for Ultra-Clean ESD Protection

Permanently Stable Resistivity Control

Our formula locks surface resistivity in the 10⁶–10⁹ Ω/sq range across continuous operating temperatures up to 260°C, eliminating the risk of sudden electrostatic discharge that can irreversibly damage sensitive electronic components.
Unlike surface-coated ESD solutions, the antistatic property is built directly into the polymer matrix—ensuring lifelong stability even after repeated autoclaving, chemical exposure, or precision machining, with no performance degradation over the component lifecycle.

Zero Particulate Contamination Risk

A defining advantage of our proprietary blend is the complete absence of carbon black fillers or loose particulates. Conventional carbon-filled PEEK grades often shed microscopic carbon debris during handling, injection molding, or end-use—posing critical contamination risks in ISO Class 5 cleanrooms and semiconductor fabs.
PRES ESD PEEK granules produce no sloughing or filler shedding, protecting wafers, ICs, and diagnostic sensors from micro-contamination while meeting strict outgassing and particle generation standards for high-purity processes.

Antistatic PEEK granules Applications & Use Cases

Injection grade antistatic PEEK is widely used for precision-molded components that must safely dissipate static while enduring high heat and aggressive chemicals.

Semiconductor Manufacturing

IC Test Sockets: ESD-safe, high-temp stable contacts.
Wafer Handling Clips: Protect delicate surfaces from static discharge.
Chemical-Resistant Guides: Withstand plasma and solvent exposure.

Electronics & ESD Protection

Connector Housings: Permanent static dissipation without fillers shedding.
Insulating Brackets: For high-voltage, ESD-sensitive modules.
Precision Coil Bobbins: Dimensional stability with ESD control.

Medical & Diagnostic Equipment

Sterilizable Housings: Autoclave-compatible ESD-safe enclosures.
Diagnostic Sensor Bodies: Chemically inert and static-controlled.
Surgical Tool Components: Lightweight, reusable, ESD-protective.

High-End Industrial Molding

Precision Pump Components: ESD-safe and wear-resistant.
Cleanroom Automation Parts: Low particle generation + static control.
High-Temp Gear & Bushings: Molded-in ESD performance.

| Injection Grade Antistatic PEEK Data Sheet

Technical Specifications (Antistatic PEEK Pellets)
Property	Units	Test Method	Typical Value
Electrical
Surface Resistivity	Ω/sq	ASTM D257	10⁶ – 10⁹
Volume Resistivity	Ω·cm	ASTM D257	10⁶ – 10⁹
Thermal
Glass Transition Temp (Tg)	°C	D3418	143
Melting Temp (Tm)	°C	D3418	343
Continuous Use Temp	°C	–	260
Thermal Expansion Coefficient(below Tg)	ppm/K	ISO 11359	8
Thermal Expansion Coefficient(over Tg)	ppm/K	ISO 11359	8
Mechanical
Tensile Strength	MPa	ISO 527	210
Flexural Modulus	GPa	ISO 178	16
Processing
Melt Temperature	°C	–	370 – 390
Mold Temperature	°C	–	160 – 190
Note: The mechanical properties shown are representative values measured under specified standard test conditions. Actual molded-part performance depends on part geometry and processing conditions, including gate design, screw speed, and injection parameters. Excessive carbon-fiber breakage can reduce the effective reinforcement and result in lower mechanical strength.

Tested by PRES Material Lab (ISO 17025 accredited) in Feb 202
6Supplied to 3 leading Asian OSATs for IC test sockets since 2024
10⁶–10⁹Ω/sq resistivity retained after 50 autoclave cycles (PRES internal test)

| FAQs – Injection Grade Antistatic PEEK Pellets

Q1: How is antistatic PEEK different from conductive PEEK?

Antistatic PEEK controls surface resistivity in the 10 ⁶–10 ⁹ Ω/sq range, safely dissipating static without sudden discharge. Conductive PEEK (often >30% carbon fiber) is much lower in resistance and better suited for full EMI shielding rather than gentle ESD protection.

Q2: Does the antistatic performance wash or wear off?

No. The antistatic mechanism is built into the polymer matrix itself, so it remains stable over the component's lifetime—even after repeated sterilization, chemical exposure, or machining.

Q3: Is this grade suitable for thin-wall precision molding?

Yes. This injection-grade formulation offers excellent melt flow and low mold shrinkage, making it ideal for thin-wall ESD-safe connectors, test sockets, and micro-sized semiconductor components.